The new MediaTek Dimensity 1200 and Dimensity 1100 5G smartphone chipsets were unveiled, giving future handsets the ability to have unrivaled AI, camera, and multimedia features for powerful 5G experiences. This latest 6nm chipsets are a welcome addition to MediaTek’s portfolio giving device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements, and more.
“MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier. Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio, and gaming enhancements,” according to JC Hsu, Corporate Vice President and General Manager of MediaTek’s Wireless Communications Business Unit.
The key features of MediaTek Dimensity 1200 and 1100 5G chipsets include a highly integrated 5G modem with MediaTek’s 5G UltraSave technology for big power savings. Both chipsets support every connectivity generation from 2G to 5G, in addition to supporting the latest connectivity features including 5G standalone and non-standalone architectures, 5G carrier aggregation (2CC) across frequency division duplex (FDD), and time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR). The chipsets also integrate 5G HSR Mode and 5G Elevator Mode enhancements to ensure a seamless, reliable 5G connection across networks.
Devices using these latest chipsets will have the ability to shoot 200MP photos with its five-core HDR-ISP and 4K HDR video capture for a significantly greater dynamic range. The chipset integrates an updated version of MediaTek’s hexa-core AI processor (MediaTek APU 3.0), which has an enhanced multi-task scheduler that reduces latency and improves power-efficiency.
These new chipsets support AI camera features including AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR), and HDR capabilities. The chipsets also support new AI-enhanced video playback features including AI SDR-to-HDR.
The Dimensity 1200 has an octa-core CPU designed with an ultra-core Arm Cortex-A78 clocked up to 3GHz for extreme performance, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores. With a nine-core GPU and six-core MediaTek APU 3.0, the Dimensity 1200 delivers a new level of premium performance.
While the Dimensity 1100 is designed with an octa-core CPU which includes four Arm Cortex-A78 cores operating at up to 2.6GHz and four Arm Cortex-A55 efficiency cores, along with a nine-core Arm Mali-G77 GPU. Both chipsets are manufactured on TSMC’s advanced 6nm process technology.
Dimensity 1200 has already received TÜV Rheinland certification for its 5G performance, with tests covering 72 real-world scenarios. The certification verifies that the chipset provides reliable, high-performance 5G connectivity and offers users high-quality 5G experiences across a wide variety of scenarios.
Xiaomi, Vivo, OPPO, and Realme expressed support for MediaTek’s new Dimensity chip. The first devices with the new MediaTek Dimensity 1200 and 1100 chipsets are expected to hit the market at the end of Q1 and the beginning of Q2 this year. Other industry collaborators and supporters of the new MediaTek 5G chipsets include Arm, China Mobile, Tetras.AI, ArcSoft, and Tencent Games.